More Details

Contributors:

Institute of Electrical and Electronics Engineers

IEEE Xplore (Online service)

Meetings:

International Symposium on High Density Packaging and Microsystem Integration

Languages:

English

Language Notes:

Item content: English

Main Work:

Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration (Online) [International Symposium on High Density Packaging and Microsystem Integration]

Other Related Resources:

In: IEEE/IEE electronic library

Also in print: Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration [International Symposium on High Density Packaging and Microsystem Integration] (ISSN 2151-2248; LCCN 2009204161; OCLC Number 449185499)

Alternate Titles:

Abbreviated title: Proc. Int. Symp. High Density Packag. Microsyst. Integr. (Online)
ISSN key title: Proceedings of ... International Symposium on High Density Packaging and Microsystem Integration (Online)
Other title: Proceedings of HDP
Other title: Proceedings HDP
Other title: International Symposium on High Density Packaging and Microsystem Integration
IEEE Xplore title: High Density packaging and Microsystem Integration... HDP... International Symposium on

Subjects:

Microelectronics — Congresses

Microelectronic packaging — Congresses

Integrated circuits — Design and construction — Congresses

System Details:

Mode of access: World Wide Web.

General Notes:

Access restricted to subscribing institutions.
Description based on print version record.

ISSNs:

2151-2256
ISSN-L: 2151-2248

Library of Congress Control Numbers:

2009204162

Other Control Numbers:

ssj0003203944 (source: WaSeSS)